Highcon debut at Hunkeler Innovationdays
Highcon Systems Ltd. will be making its first appearance at the biennial Hunkeler Innovationdays this year, 23-26 February in Lucerne, Switzerland.
Innovation is the keyword for Highcon. The company strives to deliver the innovation and differentiation that converters, printers, brand owners and retailers have all been waiting for, transforming “finishing” into a value adding process that can positively impact users’ profitability.
– Hunkeler is well known for its association with innovation and Highcon is proud to be participating for the first time this year, comments Nigel Tracey.
– At the Highcon booth ( F03) at the entrance to the hall, visitors will be able to see samples of commercial and packaging products digitally cut and creased on the Highcon Euclid. Further samples, the fruit of cooperation with digital printing vendors, can be seen at the HP, Screen and Xeikon booths, he concludes.
The Hunkeler Innovationdays follow on presentations that Highcon has given recently, introducing the Highcon digital finishing solution to new audiences. Just last week, the company hosted a highly successful “Digital Packaging” day together with HP Indigo and Scodix for the Israel Institute of Packaging & Design. In addition, Eitan Varon, Highcon Executive V.P., addressed brand owner visitors at PACE (Packaging & Converting Executive Forum) in Brussels to present them with the new infinite design capabilities of this brand new technology.
The Highcon Euclid is the first fully digital cutting and creasing machine for converting paper, labels, folding carton and microflute. The Euclid incorporates Highcon’s patented ‘DART’ (Digital Adhesive Rule Technology) to produce creases, and high-speed laser optics for cutting and etching.